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Electronics and Telecommunications Research Institute, Chips&Media Inc, Industry-University Cooperation Foundation Korea Aerospace University and Industry Academy Cooperation Foundation of Sejong University Submits Patent Application for Method and Device

Press/Media

Period2021.09.2

Media coverage

1

Media coverage

  • TitleElectronics and Telecommunications Research Institute, Chips&Media Inc, Industry-University Cooperation Foundation Korea Aerospace University and Industry Academy Cooperation Foundation of Sejong University Submits Patent Application for Method and Device
    Media name/outletGlobal IP News. Software Patent News
    Country/TerritoryIndia
    Date21.09.2
    PersonsYong-Hyun Kim