Examination Of Thermal Issues Related to Hybrid Bonding of 3D-Stacked HBM

Media coverage

• Title	Examination Of Thermal Issues Related to Hybrid Bonding of 3D-Stacked HBM
  Media name/outlet	Semiconductor Engineering
  Country/Territory	United States
  Date	25.07.16
  URL	ct.moreover.com/?a=57227383658&p=1gw&v=1&x=fg3kNg6-_N6L-Z2Jsl6GFA
  Persons	Jong-Suk Kim, Jong-Gook Kim