Findings from Chungbuk National University in the Area of Electronics Reported (Thermal Issues Related To Hybrid Bonding of 3d-stacked High Bandwidth Memory: a Comprehensive Review)

Media coverage

• Title	Findings from Chungbuk National University in the Area of Electronics Reported (Thermal Issues Related To Hybrid Bonding of 3d-stacked High Bandwidth Memory: a Comprehensive Review)
  Media name/outlet	South Korea Daily Report
  Country/Territory	United States
  Date	25.07.31
  Persons	Jong-Suk Kim, Jong-Gook Kim