2D Single-Crystalline Copper Nanoplates as a Conductive Filler for Electronic Ink Applications
- Jin Won Lee
- , Jiyoon Han
- , Dong Su Lee
- , Sukang Bae
- , Sang Hyun Lee
- , Seoung Ki Lee
- , Byung Joon Moon
- , Chel Jong Choi
- , Gunuk Wang
- , Tae Wook Kim*
*Corresponding author for this work
- Korea Institute of Science and Technology
- Korea University
Research output: Contribution to journal › Journal article › peer-review
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