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A novel superlattice band-gap engineered (SBE) capacitorless DRAM cell with extremely short channel length down to 30 nm

  • Sunyeong Lee*
  • , J. Jang
  • , J. Shin
  • , H. Kim
  • , H. Bae
  • , D. Yun
  • , D. H. Kim
  • , D. M. Kim
  • *Corresponding author for this work
  • Kookmin University

Research output: Contribution to conferenceConference paperpeer-review

Abstract

We propose a novel SiGe superlattice band-gap engineered (SBE) capacitorless dynamic random access memory (DRAM) cell with the 30 nm channel by the 2D TCAD simulation. The SBE capacitorless DRAM cell used a common source structure and different metal layers for the top gate word line from the bottom gate word line to realize the 4F2 (0.0036 μm2) feature size. From the 2D TCAD simulation of the SBE capacitorless DRAM cell, thanks to both the Si0.8Ge0.2 quantum well and SiO2 physical energy barrier, we obtained the sensing margin of 6.4 μA and the retention time of 15 msec.

Original languageEnglish
Title of host publication2010 IEEE International Memory Workshop, IMW 2010
DOIs
StatePublished - 2010
Event2010 IEEE International Memory Workshop, IMW 2010 - Seoul, Korea, Republic of
Duration: 2010.05.162010.05.19

Publication series

Name2010 IEEE International Memory Workshop, IMW 2010

Conference

Conference2010 IEEE International Memory Workshop, IMW 2010
Country/TerritoryKorea, Republic of
CitySeoul
Period10.05.1610.05.19

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