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A Novel Technique for Curing Hot-Carrier-Induced Damage by Utilizing the Forward Current of the PN-Junction in a MOSFET

  • Geon Beom Lee
  • , Choong Ki Kim
  • , Jun Young Park
  • , Tewook Bang
  • , Hagyoul Bae
  • , Seong Yeon Kim
  • , Seung Wan Ryu
  • , Yang Kyu Choi*
  • *Corresponding author for this work
  • Korea Advanced Institute of Science and Technology
  • SK Corporation

Research output: Contribution to journalJournal articlepeer-review

Abstract

The hot-carrier-induced damage of a gate dielectric was cured with Joule heat generated by the forward current of the p-n junction between the body and drain, for the first time. The effective recovery voltage and pulse time were optimized to cure the gate dielectric damage produced by hot-carrier injection. Moreover, iterative damage and cyclic curing were experimentally demonstrated. Through low-frequency noise analyses, the degradation and recovery were verified by identifying trap density along the depth of the gate dielectric. Furthermore, this proposed method produced nearly the same recovery characteristics through source-to-body junction current in a short-channel device.

Original languageEnglish
Article number7955015
Pages (from-to)1012-1014
Number of pages3
JournalIEEE Electron Device Letters
Volume38
Issue number8
DOIs
StatePublished - 2017.08

Keywords

  • Degradation
  • forward current
  • gate dielectric curing
  • hot-carrier injection (HCI)
  • Joule heat
  • low-frequency noise (LFN) characterization
  • metal-oxide-silicon field effect transistor (MOSFET)
  • PN-junction
  • recovery
  • short-channel effects (SCEs)

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