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Amphiphilic block co-polymer and silica reinforced epoxy composite with excellent toughness and delamination resistance for durable electronic packaging application

  • Minkyu Lee
  • , Sarbaranjan Paria
  • , Subhadip Mondal
  • , Gi Bbeum Lee
  • , Beomsu Shin
  • , Suhyun Kim
  • , Sungjune Park
  • , Changwoon Nah*
    • *Corresponding author for this work
  • Jeonbuk National University

Research output: Contribution to journal › Journal article › peer-review

29   Link opens in a new tab Scopus citations

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