Abstract
Purpose of this study is reviewing the use method for the sawdust (sawmilling by-product) and rice husk (Agriculture by-product) by adding charcoal, an eco-friendly material. Mixed composite boards were manufactured with those materials with each density and mixing ratio, and bending performance was investigated. When the addition ratio of sawdust, rice husk and charcoal is 50:20:20 and the resin addition ratio is 10%, as the density of the prepared mixed board ranges from 0.5 g/㎤ to 0.7 g/㎤, the bending strength was 0.42∼3.24 N/㎟, dynamic modulus of elasticity was 94.5~888.4 N/㎟, and the static modulus of elasticity was in the range of 31.4∼220.7 N/㎟. As the density increased, the bending performance increased, indicating that the density had a significant effect on the bending performance. In a board prepared by setting the density of 0.6 g/㎤, the addition ratio of sawdust to 50%, and the addition ratio of rice husk and charcoal at different ratios, the bending performance showed a tendency to decrease as the addition ratio of charcoal increased. The relationship between the addition ratio of rice husk and charcoal, bending strength, resonance frequency, and dynamic and static bending modulus showed a rather low correlation with the values of the coefficient of determination (R2) of 0.4562, 0.4310, 0.4589, and 0.5847, respectively. Thus, we found that the effect of the addition ratio on the bending performance was small.
| Original language | English |
|---|---|
| Pages (from-to) | 315-327 |
| Number of pages | 13 |
| Journal | Journal of the Korean Wood Science and Technology |
| Volume | 49 |
| Issue number | 4 |
| DOIs | |
| State | Published - 2021 |
Keywords
- Bending strength
- Charcoal
- Composite board
- Dynamic modulus of elasticity
- Rice husk
- Sawdust
Quacquarelli Symonds(QS) Subject Topics
- Engineering - Mechanical
- Materials Science
Fingerprint
Dive into the research topics of 'Bending strength of board manufactured from sawdust, rice husk and charcoal1 kor app'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver