Carrier-transport mechanism of Er-silicide Schottky contacts to strained-silicon-on-insulator and silicon-on-insulator

  • I. Jyothi
  • , V. Janardhanam
  • , Min Sung Kang
  • , Hyung Joong Yun
  • , Jouhahn Lee
  • , Chel Jong Choi*
  • *Corresponding author for this work

Research output: Contribution to journalJournal articlepeer-review

Abstract

The current-voltage characteristics and the carrier-transport mechanism of the Er-silicide (ErSi17) Schottky contacts to strained-silicon-on-insulator (sSOI) and silicon-on-insulator (SOI) were investigated. Barrier heights of 0.74 eV and 0.82 eV were obtained for the sSOI and SOI structures, respectively. The barrier height of the sSOI structure was observed to be lower than that of the SOI structure despite the formation of a Schottky contact using the same metal silicide. The sSOI structure exhibited better rectification and higher current level than the SOI structure, which could be associated with a reduction in the band gap of Si caused by strain. The generation-recombination mechanism was found to be dominant in the forward bias for both structures. Carrier generation along with the Poole-Frenkel mechanism dominated the reverse-biased current in the SOI structure. The saturation tendency of the reverse leakage current in the sSOI structure could be attributed to strain-induced defects at the interface in non-lattice-matched structures.

Original languageEnglish
Pages (from-to)8176-8181
Number of pages6
JournalJournal of nanoscience and nanotechnology
Volume14
Issue number11
DOIs
StatePublished - 2014.11.1

Keywords

  • Carrier-Transport Mechanism
  • Er-Silicide
  • Schottky Contact
  • SOI
  • sSOI
  • Strain

Quacquarelli Symonds(QS) Subject Topics

  • Materials Science
  • Engineering - Chemical
  • Chemistry
  • Physics & Astronomy
  • Biological Sciences

Fingerprint

Dive into the research topics of 'Carrier-transport mechanism of Er-silicide Schottky contacts to strained-silicon-on-insulator and silicon-on-insulator'. Together they form a unique fingerprint.

Cite this