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Compact Hybrid-Integrated 4 × 80-Gbps TROSA Module Using Optical Butt-Coupling of DML/SI-PD and Silica AWG Chips

  • Seok Jun Yun
  • , Young Tak Han*
  • , Seok Tae Kim
  • , Jang Uk Shin
  • , Sang Ho Park
  • , Dong Hoon Lee
  • , Seo Young Lee
  • , Yongsoon Baek
  • *Corresponding author for this work
  • Electronics and Telecommunications Research Institute

Research output: Contribution to journalJournal articlepeer-review

Abstract

We have developed a compact 4 × 80-Gbps transmitter-receiver optical subassembly (TROSA) module using a chip-to-chip optical butt-coupling method. For a Tx submodule, four directly modulated laser (DML) chips precisely bonded on a silicon DML-carrier are simultaneously butt-coupled to a vertically polished silica-based arrayed waveguide grating (AWG) chip, revealing good optical characteristics insensitive to external optical feedback. A Rx submodule is realized by passive alignment between a 45°-polished AWG and four surface-illuminated (SI)-PD chips, and subsequently integrated with the Tx submodule into a single package case to form the compact TROSA module whose size is only 25 mm × 15 mm × 6.4 mm and compliant to fit into the QSFP-DD/OSFP transceiver. The fabricated TROSA module shows clear Tx optical eye patterns at 80-Gbps PAM4 signals for all channels, achieving the Rx sensitivities within -7.1∼-6 dBm at a bit error rate (BER) of 2.4 × 10-4.

Original languageEnglish
Article number9320538
Pages (from-to)2468-2475
Number of pages8
JournalJournal of Lightwave Technology
Volume39
Issue number8
DOIs
StatePublished - 2021.04.15

Keywords

  • 4-level pulse amplitude modulation (PAM4)
  • Datacenter
  • directly modulated laser (DML)
  • optical butt-coupling
  • silica-based planar lightwave circuit (PLC)
  • surface-illuminated (SI)-PD
  • transmitter-receiver optical subassembly (TROSA)

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