@inproceedings{2b7f328e8eae4cfb9e114e35ac0d6ca3,
title = "Computer simulation of fluid flow, heat transfer for the production of Cu thin wire by OCC process",
abstract = "In the present study, the fluid flow and the heat transfer with solidification analyses for the Cu thin wire production by OCC (Ohno Continuous Casting) process. The OCC process is widely used to produce cylindrical column castings continuously, a number of researches have been focused on the OCC process. However, few researches on the production of Cu thin wire by the OCC process have been reported, therefore it is necessary to investigate and optimize the process variables of the OCC process when producing the Cu thin wires. A commercial multiphysics software was used to analyse to the flow pattern and the temperature distribution in the OCC system proposed in the present study. Effect of the casting speed, the OCC mold temperature, the melt temperature on the castablility of the thin Cu wire and flow pattern and temperature distribution of the melt were discussed. It is expected that the present study is able to give the design parameters of the OCC system for production of Cu thin wire before the actual OCC system construction.",
keywords = "Cu thin wire, OCC process, Solidification analyses",
author = "Jang, \{Kyung Wook\} and Lee, \{Jung II\} and Lee, \{Joo Ho\} and Cho, \{Kyoung Won\} and Choi, \{Good Sun\} and Lim, \{Jae Won\} and Yang, \{Gwon Seung\}",
year = "2009",
doi = "10.4028/www.scientific.net/MSF.620-622.375",
language = "English",
isbn = "0878493271",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd",
pages = "375--378",
booktitle = "10th International Symposium on Eco-Materials Processing and Design, ISEPD 2009",
note = "10th International Symposium on Eco-Materials Processing and Design, ISEPD 2009 ; Conference date: 13-01-2009 Through 15-01-2009",
}