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Computer simulation of fluid flow, heat transfer for the production of Cu thin wire by OCC process

  • Kyung Wook Jang*
  • , Jung II Lee
  • , Joo Ho Lee
  • , Kyoung Won Cho
  • , Good Sun Choi
  • , Jae Won Lim
  • , Gwon Seung Yang
  • *Corresponding author for this work
  • Hanseo University
  • Korea National University of Transportation
  • Korea Institute of Geoscience and Mineral Resources
  • Chosun University

Research output: Contribution to conferenceConference paperpeer-review

Abstract

In the present study, the fluid flow and the heat transfer with solidification analyses for the Cu thin wire production by OCC (Ohno Continuous Casting) process. The OCC process is widely used to produce cylindrical column castings continuously, a number of researches have been focused on the OCC process. However, few researches on the production of Cu thin wire by the OCC process have been reported, therefore it is necessary to investigate and optimize the process variables of the OCC process when producing the Cu thin wires. A commercial multiphysics software was used to analyse to the flow pattern and the temperature distribution in the OCC system proposed in the present study. Effect of the casting speed, the OCC mold temperature, the melt temperature on the castablility of the thin Cu wire and flow pattern and temperature distribution of the melt were discussed. It is expected that the present study is able to give the design parameters of the OCC system for production of Cu thin wire before the actual OCC system construction.

Original languageEnglish
Title of host publication10th International Symposium on Eco-Materials Processing and Design, ISEPD 2009
PublisherTrans Tech Publications Ltd
Pages375-378
Number of pages4
ISBN (Print)0878493271, 9780878493272
DOIs
StatePublished - 2009
Event10th International Symposium on Eco-Materials Processing and Design, ISEPD 2009 - Xian, China
Duration: 2009.01.132009.01.15

Publication series

NameMaterials Science Forum
Volume620 622
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

Conference10th International Symposium on Eco-Materials Processing and Design, ISEPD 2009
Country/TerritoryChina
CityXian
Period09.01.1309.01.15

Keywords

  • Cu thin wire
  • OCC process
  • Solidification analyses

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