Abstract
Pb(Zr,Ti)O3 films were deposited at 540°C on trenched substrates with submicrometer diameters by pulsed-metallorganic chemical vapor deposition. The respective fluctuations of Pb/(Zr+Ti) and Zr/(Zr+Ti) molar ratios were in a range of ±19 and ±17% from each average value at the sidewalls of trenches with a diameter of 200 nm and a depth of 685 nm (aspect ratio of 3.4). The sidewall-bottom step coverage was successfully maintained above 70% up to a depth of 685 nm. The present results show the possibility of uniform Pb(Zr,Ti)O3 film deposition on the trench substrates with high aspect ratio.
| Original language | English |
|---|---|
| Pages (from-to) | C15-C18 |
| Journal | Electrochemical and Solid-State Letters |
| Volume | 9 |
| Issue number | 1 |
| DOIs | |
| State | Published - 2006 |
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