Abstract
Cu-Ni-P nanoparticles were produced by electrical explosion of Cu wires coated with electroless Ni. The average composition of the coated wire was Cu49Ni43P8. X-ray diffraction study revealed that the explosion with a pulse voltage of 28 kV produced a single phase Cu-Ni-P solid solution the average composition of which was Cu56Ni41P3. The lattice parameter of Cu-Ni-P solid solution was 3.5798 Å. Phosphor was reduced by evaporation during explosion. When the energy to the wire is reduced, a mixture of Cu-rich solid solution and Ni-rich solid solution was produced with increased amount of Ni3P phase.
| Original language | English |
|---|---|
| Pages (from-to) | L4-L6 |
| Journal | Journal of Alloys and Compounds |
| Volume | 465 |
| Issue number | 1-2 |
| DOIs | |
| State | Published - 2008.10.6 |
Keywords
- Cu-Ni
- Cu-Ni-P
- Electroless deposition
- Nanopowder
- Wire explosion
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