TY - GEN
T1 - Design considerations for low stray impedance printed-circuit-boards for switching converters
AU - Baek, Seunghun
AU - Lee, Jaesuk
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/10
Y1 - 2019/10
N2 - A structure and layout of printed-circuit-board (PCB) have a considerable impact on the overall system efficiency and switching performance for high-frequency applications. The current distribution of the copper traces can be significantly distorted due to eddy and proximity effects as the switching frequency increases. Also, stray inductances are the main source of destructive switching ringing and electromagnetic interference (EMI). They both are often designed to be minimized, however, it is difficult to quantify and design the effects in the complex geometry of PCB layout. PCBs for power transfer has been often designed by a rule of thumb. The practical case of the printed circuit board for a resonant-type grid-tied switching converter is studied to reduce the stray inductances and effective resistances at switching frequency of several hundreds of kHz in this paper. Quantitative studies with the exact geometry of PCB from Gerber files are conducted using three-dimensional finite element analysis (FEA) tools. The overall process is integrated and linked by scripting glue language, Python. The suggested structure and layout show considerable improvement by rearranging patterns of copper traces and properly handling high-frequency effects.
AB - A structure and layout of printed-circuit-board (PCB) have a considerable impact on the overall system efficiency and switching performance for high-frequency applications. The current distribution of the copper traces can be significantly distorted due to eddy and proximity effects as the switching frequency increases. Also, stray inductances are the main source of destructive switching ringing and electromagnetic interference (EMI). They both are often designed to be minimized, however, it is difficult to quantify and design the effects in the complex geometry of PCB layout. PCBs for power transfer has been often designed by a rule of thumb. The practical case of the printed circuit board for a resonant-type grid-tied switching converter is studied to reduce the stray inductances and effective resistances at switching frequency of several hundreds of kHz in this paper. Quantitative studies with the exact geometry of PCB from Gerber files are conducted using three-dimensional finite element analysis (FEA) tools. The overall process is integrated and linked by scripting glue language, Python. The suggested structure and layout show considerable improvement by rearranging patterns of copper traces and properly handling high-frequency effects.
KW - finite-element-analysis
KW - high-frequency switching converters
KW - loop impedance
KW - Printed-circuit-board
UR - https://www.scopus.com/pages/publications/85077966301
U2 - 10.1109/ISEE2.2019.8921226
DO - 10.1109/ISEE2.2019.8921226
M3 - Conference paper
AN - SCOPUS:85077966301
T3 - Proceedings - 2019 International Symposium on Electrical and Electronics Engineering, ISEE 2019
SP - 247
EP - 251
BT - Proceedings - 2019 International Symposium on Electrical and Electronics Engineering, ISEE 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 International Symposium on Electrical and Electronics Engineering, ISEE 2019
Y2 - 10 October 2019 through 12 October 2019
ER -