Abstract
As the standard complementary metal-oxide-semiconductor (CMOS) integrated circuit (IC) generates a leakage current due to ionizing radiation reacting with silicon in a radiological environment, radiation hardening of CMOS devices is being actively investigated. If a radiation-tolerant IC (RTIC) is designed, it is very important to examine the design possibility of an application specific IC (ASIC) that uses a radiation-tolerant MOS field-effect transistor (MOSFET). This study developed a new RTIC design using an I-gate structure that is more effective in terms of time, cost, and reliability than the existing RTMOSFET. Because an RTIC with an I-gate structure can be fabricated via the usual full-custom IC design process, it can be produced after its reliability is ensured based on post-layout simulation results, which are obtained by layout parasitic extraction (LPE). To realize the possibility of such fabrication, radiation-tolerant digital and analog ICs were designed and fabricated in the standard 0.18-μ m CMOS process, and an irradiation test was conducted up to a total dose of approximately 2 Mrad. Accordingly, the radiation damage in the standard IC and the radiation tolerance of the RTIC were identified. Consequently, we have proposed and verified an efficient radiation-tolerant ASIC design solution.
| Original language | English |
|---|---|
| Article number | 9092997 |
| Pages (from-to) | 459-467 |
| Number of pages | 9 |
| Journal | IEEE Transactions on Device and Materials Reliability |
| Volume | 20 |
| Issue number | 2 |
| DOIs | |
| State | Published - 2020.06 |
Keywords
- application specific IC (ASIC)
- full custom IC design
- leakage current path
- post-layout simulation
- Radiation-tolerant integrated circuit (RTIC)
- total ionizing dose (TID) effect
Quacquarelli Symonds(QS) Subject Topics
- Materials Science
- Engineering - Electrical & Electronic
- Engineering - Petroleum
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