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Direct-patterned copper/poly(ethylene oxide) composite electrodes for organic thin-film transistors through cone-jet mode by electrohydrodynamic jet printing

  • Xinlin Li
  • , Hyeok jin Kwon
  • , Xue Qi
  • , Ho Kwang Choi
  • , Sooman Lim*
  • , Tae Wook Kim
  • , Se Hyun Kim
  • *Corresponding author for this work
  • Qingdao University
  • Yeungnam University
  • Pohang University of Science and Technology
  • Jeonbuk National University

Research output: Contribution to journalJournal articlepeer-review

Abstract

Direct-patterned Cu-based conductive electrodes were printed through electrohydodynamic (EHD) jet printing via cone-jet mode. The introduction of a capping agent in the synthesis of the Cu ink limited excessive conductivity, which enabled the pristine Cu ink to achieve the various printing modes of EHD jet printing: dripping, micro-dripping, cone-jet, and multi-jet. We also obtained optimal printing conditions by adjusting the viscosity by adding poly(ethylene oxide) (PEO) to the pristine Cu inks, resulting in well-defined printing patterns. The optimized PEO content in the ink was determined to be ∼10 wt%, which gave us a stable cone-jet mode and well-defined Cu/PEO composite electrode lines with sharp edges. We utilized the Cu/PEO composite electrode lines as source and drain and a triisopropylsilylethynyl (TIPS)–pentacene/PS blend as the active layer for bottom-gate bottom-contact organic field-effect transistors (OFETs). The resulting devices exhibited an average field-effect mobility (μFET), threshold voltage (Vth), and on/off current ratio (Ion/Ioff) of 0.253 cm2/V, 0.253 V, and ∼106, respectively.

Original languageEnglish
Pages (from-to)269-275
Number of pages7
JournalJournal of Industrial and Engineering Chemistry
Volume85
DOIs
StatePublished - 2020.05.25

Keywords

  • Capping agent
  • Cu nanoplates
  • Cu/poly(ethylene oxide) composite
  • Electrohydrodymic jet printing
  • Organic field-effect transistors
  • Printed electronics

Quacquarelli Symonds(QS) Subject Topics

  • Engineering - Chemical

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