DSC studies upon thermal curing of methylsilsesquinoxane

Kitae Song; Byoung Suhk Kim; Jae Wook Lee; Hee Woo Rhee

doi:10.1080/10587250108030095

DSC studies upon thermal curing of methylsilsesquinoxane

Kitae Song^*
, Byoung Suhk Kim
, Jae Wook Lee
, Hee Woo Rhee

^*Corresponding author for this work

Department of Organic Materials and Textile Engineering

Sogang University

Research output: Contribution to journal › Journal article › peer-review

Abstract

A conventional DSC was used to investigate the thermal curing behavior of methylsilsesquioxane (MSSQ) which transforms into the low dielectric constant material, poly(MSSQ). Temperature scan of MSSQ up to 350°C revealed that the curing of MSSQ is an endothermic reaction that occurs over the wide temperature range. From the isothermal scan of MSSQ, it was found that the curing of MSSQ follows the first-order reaction.

Original language	English
Pages (from-to)	309-312
Number of pages	4
Journal	Molecular Crystals and Liquid Crystals Science and Technology Section A: Molecular Crystals and Liquid Crystals
Volume	370
DOIs	https://doi.org/10.1080/10587250108030095
State	Published - 2001

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

Keywords

Low dielectric constant material
Methylsilsesquioxane
Thermal curing

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10.1080/10587250108030095

Cite this

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title = "DSC studies upon thermal curing of methylsilsesquinoxane",

abstract = "A conventional DSC was used to investigate the thermal curing behavior of methylsilsesquioxane (MSSQ) which transforms into the low dielectric constant material, poly(MSSQ). Temperature scan of MSSQ up to 350°C revealed that the curing of MSSQ is an endothermic reaction that occurs over the wide temperature range. From the isothermal scan of MSSQ, it was found that the curing of MSSQ follows the first-order reaction.",

keywords = "Low dielectric constant material, Methylsilsesquioxane, Thermal curing",

author = "Kitae Song and Kim, \{Byoung Suhk\} and Lee, \{Jae Wook\} and Rhee, \{Hee Woo\}",

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journal = "Molecular Crystals and Liquid Crystals Science and Technology Section A: Molecular Crystals and Liquid Crystals",

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AU - Song, Kitae

AU - Kim, Byoung Suhk

AU - Lee, Jae Wook

AU - Rhee, Hee Woo

PY - 2001

Y1 - 2001

N2 - A conventional DSC was used to investigate the thermal curing behavior of methylsilsesquioxane (MSSQ) which transforms into the low dielectric constant material, poly(MSSQ). Temperature scan of MSSQ up to 350°C revealed that the curing of MSSQ is an endothermic reaction that occurs over the wide temperature range. From the isothermal scan of MSSQ, it was found that the curing of MSSQ follows the first-order reaction.

AB - A conventional DSC was used to investigate the thermal curing behavior of methylsilsesquioxane (MSSQ) which transforms into the low dielectric constant material, poly(MSSQ). Temperature scan of MSSQ up to 350°C revealed that the curing of MSSQ is an endothermic reaction that occurs over the wide temperature range. From the isothermal scan of MSSQ, it was found that the curing of MSSQ follows the first-order reaction.

KW - Low dielectric constant material

KW - Methylsilsesquioxane

KW - Thermal curing

UR - https://www.scopus.com/pages/publications/31944441213

U2 - 10.1080/10587250108030095

DO - 10.1080/10587250108030095

M3 - Journal article

AN - SCOPUS:31944441213

SN - 1058-725X

VL - 370

SP - 309

EP - 312

JO - Molecular Crystals and Liquid Crystals Science and Technology Section A: Molecular Crystals and Liquid Crystals

JF - Molecular Crystals and Liquid Crystals Science and Technology Section A: Molecular Crystals and Liquid Crystals

ER -

DSC studies upon thermal curing of methylsilsesquinoxane

Abstract

UN SDGs

Keywords

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