Abstract
We report a dual-sweep combinational transconductance technique for separate extraction of parasitic source (RS) and drain (RD) resistances in thin-film transistors (TFTs) by combining forward and reverse transfer characteristics. In the proposed technique, gate bias-dependent total resistance [RTOT (VGS] and degradation of the transcond- uctance due to the parasitic resistance at the source terminal during the dual-sweep characterization are employed. Applying the proposed technique to amorphous oxide semiconductor TFTs with various combinations of channel length (L) and width (W), we successfully separated RS and RD. A model for the W - and L-dependences of the extracted parasitic resistances is also provided.
| Original language | English |
|---|---|
| Article number | 7001587 |
| Pages (from-to) | 144-146 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 36 |
| Issue number | 2 |
| DOIs | |
| State | Published - 2015.02.1 |
Keywords
- Drain resistance
- Dual-sweep
- Parasitic resistance
- Source resistance
- TFT
- Thin film transistors
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