@inproceedings{df22faead804481d83f36435d501d1cf,
title = "Dynamic spectroscopic imaging ellipsometer for high-throughput full patterned wafer mapping",
abstract = "We propose a robust dynamic spectroscopic imaging ellipsometer (DSIE) as a future high-throughput full pattern wafer inspection candidate in semiconductor MI fields. In this study, we demonstrate a Linnik-type monolithic polarizing interferometer scheme combined with a simple spectrometer-based compensation channel can enhance system robustness and stability drastically. Also, we address the importance of the global mapping phase error compensation method by which highly reliable 3-D cubic spectroscopic ellipsometric parameter mapping capability can be provided for a large-scale specimen. To show the efficacy of the proposed compensation method experimentally, we measure a 12-inch full size silicone-dioxide thin film and a 8-inch nano-pattern wafer in a general environment where various external disturbances can affect the system stability.",
keywords = "full patterned wafer inspection, high-throughput, Imaging spectroscopic ellipsometer, one-piece polarizing interferometer",
author = "G. Hwang and S. Kheiryzadehkhanghah and S. Choi and I. Choi and S. Kim and D. Kim",
note = "Publisher Copyright: {\textcopyright} 2024 SPIE.; Metrology, Inspection, and Process Control XXXVIII 2024 ; Conference date: 26-02-2024 Through 29-02-2024",
year = "2024",
doi = "10.1117/12.3011003",
language = "English",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Sendelbach, \{Matthew J.\} and Schuch, \{Nivea G.\}",
booktitle = "Metrology, Inspection, and Process Control XXXVIII",
}