@inproceedings{0f05ad71f25c4428aac99ee5b51f3755,
title = "Dynamic ultra-thin film thickness line-profile extraction from a warped Si substrate",
abstract = "This study describes a dynamic ultra-thin film thickness line-profile extraction capability from a warped Si substrate by adding a Mach-Zehnder interferometer scheme to a dynamic spectroscopic imaging ellipsometer system. The proposed system can provide nanometer-precision ultra-thin film thickness line-profile as well as the warped surface profile information of a Si substrate simultaneously and dynamically.",
keywords = "Dynamic spectroscopic imaging ellipsometry, Fourier transform, Spectral Interferometry, Spectroscopic Ellipsometry, Thickness profilometry",
author = "S. Kheiryzadehkhanghah and G. Hwang and I. Choi and S. Choi and D. Kim",
note = "Publisher Copyright: {\textcopyright} 2024 SPIE.; Metrology, Inspection, and Process Control XXXVIII 2024 ; Conference date: 26-02-2024 Through 29-02-2024",
year = "2024",
doi = "10.1117/12.3011000",
language = "English",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Sendelbach, \{Matthew J.\} and Schuch, \{Nivea G.\}",
booktitle = "Metrology, Inspection, and Process Control XXXVIII",
}