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Effect of Ar/Ar-H2 plasma arc melting on Cu purification

  • Jae Won Lim
  • , Min Seuk Kim
  • , N. R. Munirathnam
  • , Minh Tung Le
  • , Masahito Uchikoshi
  • , Kouji Mimura
  • , Minoru Isshiki
  • , Hyuk Chon Kwon
  • , Good Sun Choi*
  • *Corresponding author for this work
  • Korea Institute of Geoscience and Mineral Resources
  • Centre for Materials for Electronics Technology
  • Chungnam National University
  • Tohoku University
  • Korea Institute of Industrial Technology

Research output: Contribution to journalJournal articlepeer-review

Abstract

Removal of impurities from Cu metal by Ar and Ar-20%H2 plasma arc melting (PAM) has been carried out. Several impurities such as Li, Na, Mg, P, S, Cl, K, Ca, Zn, Pd, Pb and Bi in Cu were efficiently removed when only Ar plasma gas was used. Moreover, removal degrees for the above mentioned impurities were significantly increased after Ar-20%H2-PAM, especially for K, Zn and Pd. It was found that Ar-H2 PAM showed an excellent effect to eliminate impurities with higher vapor pressures than that of Cu metal.

Original languageEnglish
Pages (from-to)1826-1829
Number of pages4
JournalMaterials Transactions
Volume49
Issue number8
DOIs
StatePublished - 2008.08

Keywords

  • Copper
  • Glow discharge mass spectrometry
  • Hydrogen
  • Impurity
  • Plasma arc melting

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