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Effect of negative substrate bias voltage on the nucleation and growth of Cu films during the initial stage of ion beam deposition

  • Jae Won Lim*
  • , Good Sun Choi
  • , Yongfu Zhu
  • , Minoru Isshiki
  • *Corresponding author for this work
  • Korea Institute of Geoscience and Mineral Resources
  • Jilin University
  • Tohoku University

Research output: Contribution to journalJournal articlepeer-review

Abstract

We focused the effect of a negative substrate bias voltage on the nucleation and growth of Cu films during the initial stage of ion beam deposition. The resultant microstructure of Cu films was observed by atomic force microscopy (AFM). It was found that Cu films with or without a negative substrate bias voltage have a different dependence of nucleation and growth. It was established that the mechanism of nucleation and growth of Cu films is changed to a progressive nucleation and lateral growth by a sufficient migration of adatoms accelerated by applying a negative substrate bias voltage.

Original languageEnglish
Pages (from-to)381-384
Number of pages4
JournalMetals and Materials International
Volume14
Issue number3
DOIs
StatePublished - 2008.06

Keywords

  • Atomic force microscopy
  • Copper
  • Growth
  • Nucleation
  • Substrate bias voltage

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