Effect of rapid thermal annealing on the structural evolution and electrical property of gold films deposited on silicon

Research output: Contribution to conferenceConference paperpeer-review

Abstract

An investigation of the electrical and microstructural properties of gold (Au)/p-type silicon (Si) contact was performed as a function of rapid thermal annealing (RTA) temperatures. Au films reacted with Si and produced Au2Si and Au3Si phases during the deposition of the films at room temperature. The electrical properties of the Au contact to p-type Si degraded with increasing RTA temperature. Such a degradation of the electrical properties could be associated with the degradation of the surface and interface morphology caused by the formation of Au-silicide clusters. The RTA process at 500°C led to an increase in the size of the Au-silicide Island. This led to the further degradation of the electrical properties after annealing at 500°C.

Original languageEnglish
Title of host publicationInnovative Materials
Subtitle of host publicationEngineering and Applications II
EditorsJung Kyu Ahn
PublisherTrans Tech Publications Ltd
Pages97-101
Number of pages5
ISBN (Print)9783038357834
DOIs
StatePublished - 2017
EventInternational Conference on Material Engineering and Application, ICMEA 2016 - Tin Shui Wai, Hong Kong
Duration: 2016.08.192016.08.21

Publication series

NameKey Engineering Materials
Volume730 KEM
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795

Conference

ConferenceInternational Conference on Material Engineering and Application, ICMEA 2016
Country/TerritoryHong Kong
CityTin Shui Wai
Period16.08.1916.08.21

Keywords

  • Au
  • Ohmic
  • Phase evolution
  • RTA
  • Si
  • Silicide
  • Silicide clusters

Quacquarelli Symonds(QS) Subject Topics

  • Materials Science
  • Engineering - Mechanical

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