Effects of bonding layer characteristics on strain transmission and bond fatigue performance

Fiber Bragg Grating (FBG) sensor arrays can be used to monitor the mechanical behavior of large composite structures. However, brittle FBG sensors, especially multiplexed FBG sensors can be easily damaged when they are installed in flexible structures. As a protection for brittle FBG sensors, epoxy packaged FBG sensors have been suggested. Packaged FBG sensors are usually installed using epoxy adhesives onto the composite specimen since they have high mechanical, heat-resistance and insulation properties. However, the adhesive could decrease strain transmission from the bonding layer and suffer from aging problem. In this paper, strain transmission and bond fatigue performance of the bonding layer depending on the elastic modulus of adhesive, elastic modulus of packaging material and bonding layer thickness are discussed. Static tests were performed to evaluate the effects of bonding layer thickness and elastic modulus ratio of adhesive to the packaging material on strain transmission. Fatigue tests were performed to evaluate the bond fatigue performance depending on the elastic modulus of the adhesive and bonding layer thickness. It was observed that thin bonding layer with high elastic modulus gave high strain transmission, however, it suffered from debonding problem. The elastic modulus ratio and the bonding layer thickness resulting in high strain transmission while maintaining a long bond fatigue life were found in this study.