Evaluation of mechanical property for Pb-free solder/Ni plate joints with artificial aging time

Thus far, solders used in electronics remain lead-based. Pb-free solutions in electronic components and systems are receiving increased attention in the semiconductor and electronics industries. Pb-free materials currently in used are Sn-37Pb, Sn-4Ag and Sn-4Ag-0.5Cu/ Ni plate joints. In this study, solder alloys were used at high temperatures for artificial aging processing that was performed at 150°C for 0hr, 100hr, 200hr, 400hr, 600hr and 1000hr. The SP test was conducted at 30°C and 50°C. As a result, the maximum shear strength of all the specimens decreased with the increase in artificial aging time and temperature of the SP test. In addition, Pb-free solders showed higher total fracture energy compared with Sn-37Pb at high temperatures. The mechanical properties of Sn-4Ag-0.5Cu solder/Ni plate joints remained in excellent conditions in electronic parking systems at high temperatures.