@inproceedings{5fea6e6a6dcc4e7488b3679a0d8a3343,
title = "Fabrication and characterization of RF MEMS package based on LTCC lid substrate and gold-tin eutectic bonding",
abstract = "This paper reports on an RF MEMS package based on LTCC technology and gold-tin eutectic bonding, and also evaluates physical and RF characteristics of the proposed structure. The package consists of an LTCC lid substrate and a bottom substrate, and assembled by gold-tin layer (80 wt. \% gold 20 wt. \% tin) for hermetic sealing and low temperature bonding. The helium leak rate of 17 packages were 1.38 × 10-8 atm-cc/sec, and the shear strength of the bonded surface showed in the range of 36 - 50 MPa. The RF characteristics were measured up to 10 GHz, and the packaging loss was calculated to be 0.1349 dB at 2 GHz.",
keywords = "Gold-tin, LTCC, Package, RF MEMS",
author = "Bang, \{Yong Seung\} and Kim, \{Jong Man\} and Yongsung Kim and Kim, \{Jung Mu\} and Kim, \{Yong Kweon\}",
year = "2007",
doi = "10.1109/SENSOR.2007.4300583",
language = "English",
isbn = "1424408423",
series = "TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems",
pages = "2115--2118",
booktitle = "TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems",
note = "4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07 ; Conference date: 10-06-2007 Through 14-06-2007",
}