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Flow and evaporation of a thick polymer film on a rotating disk

  • Iksan National College
  • Korea University of Technology and Education
  • Korea DNS Co. Ltd.

Research output: Contribution to conferenceConference paperpeer-review

Abstract

Flow, mass transfer and film thickness variation during a thick photoresist film formation on a wafer spin coating process are numerically studied. Governing equations and boundary conditions for the cylindrical coordinates are simplified using the von Karman similarity transformation and solved by the finite difference method. The viscosity and binary diffusion coefficient are assumed to be functions of solvent concentration and the mass transfer coefficient is used to model the solvent evaporation from a free surface. The velocity components for the coating liquid and the film thickness variation with time are analyzed according to the various process parameters such as spin speeds and the initial photoresist concentrations. When the evaporation is considered, the velocity components are small due to the increase of viscosity and resultant decrease of outflow rate. The final film thickness is predicted from the wet film thickness, the thickness at the end of the spin coating process and the initial solute concentrations.

Original languageEnglish
Title of host publicationAdvances in Electronic Materials and Packaging 2001
EditorsS.B. Lee, K.W. Paik
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages178-181
Number of pages4
ISBN (Electronic)0780371577, 9780780371576
DOIs
StatePublished - 2001
Event3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of
Duration: 2001.11.192001.11.22

Publication series

NameAdvances in Electronic Materials and Packaging 2001

Conference

Conference3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
Country/TerritoryKorea, Republic of
CityJeju Island
Period01.11.1901.11.22

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