Abstract
The electrical breakdown (EBD) method was used to obtain Ohmic contact to semipolar (11-20) p-GaN surfaces using the Ti/SiO2/p-GaN structure. The EBD method by which the electrical stress voltage was increased up to 70 V with a compliance current of 30 mA resulted in an Ohmic contact with a specific contact resistance of 3.1×10−3 Ωcm2. The transmission electron microscope (TEM) analysis revealed that the oxygen was slightly out-diffused from SiO2 layer toward Ti surface and the oxidation occurred at the Ti surface, while the GaN remained unchanged.
| Original language | English |
|---|---|
| Pages (from-to) | 90-94 |
| Number of pages | 5 |
| Journal | Journal of the Korean Physical Society |
| Volume | 72 |
| Issue number | 1 |
| DOIs | |
| State | Published - 2018.01.1 |
Keywords
- Electrical breakdown method
- Ohmic contact
- Semipolar p-GaN
Quacquarelli Symonds(QS) Subject Topics
- Physics & Astronomy
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