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Formation of Ohmic contact to semipolar (11-22) p-GaN by electrical breakdown method

  • Seonghoon Jeong
  • , Sung Nam Lee
  • , Hyunsoo Kim*
  • *Corresponding author for this work
  • Jeonbuk National University
  • Tech University of Korea

Research output: Contribution to journalJournal articlepeer-review

Abstract

The electrical breakdown (EBD) method was used to obtain Ohmic contact to semipolar (11-20) p-GaN surfaces using the Ti/SiO2/p-GaN structure. The EBD method by which the electrical stress voltage was increased up to 70 V with a compliance current of 30 mA resulted in an Ohmic contact with a specific contact resistance of 3.1×10−3 Ωcm2. The transmission electron microscope (TEM) analysis revealed that the oxygen was slightly out-diffused from SiO2 layer toward Ti surface and the oxidation occurred at the Ti surface, while the GaN remained unchanged.

Original languageEnglish
Pages (from-to)90-94
Number of pages5
JournalJournal of the Korean Physical Society
Volume72
Issue number1
DOIs
StatePublished - 2018.01.1

Keywords

  • Electrical breakdown method
  • Ohmic contact
  • Semipolar p-GaN

Quacquarelli Symonds(QS) Subject Topics

  • Physics & Astronomy

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