High thermally conductive epoxy composite inks cured by infrared laser irradiation for two-dimensional/three-dimensional printing technology

  • Gi Tae Park
  • , Sung Jun Lee
  • , Byeong Guk Kim
  • , Sang Hun Lee
  • , Jae Wook Kang
  • , Bum Joo Lee*
  • , Myong Hoon Lee
  • *Corresponding author for this work

Research output: Contribution to journalJournal articlepeer-review

Abstract

We propose a new fabrication method of high thermally conductive epoxy composites for 3 D printing technology, which is based on a thermosetting epoxy system containing graphene nanoplate (GNP) as an IR-absorbing material. Firstly, we developed highly heat-dissipating inks based on bisphenol A diglycidyl ether (DGEBA) type epoxy resins containing graphene nanoplate (GNP) which was used as a heat dissipating filler and, simultaneously, an IR-absorbing material for heat induced rapid curing of printed layer. h-BN was also added as a heat dissipating filler in order to increase the thermal conductivity and to decrease the electrical conductivity of the composite. Secondly, by using a micro dispenser equipped with an IR laser, 2D/3D line patterns of thermally conductive epoxy composites were printed and cured in-situ. Thermal and electrical conductivities of the resulting composites were discussed with respect to the resin compositions and the irradiation conditions. The highest thermal conductivity of 2.77 W/m·K was achieved when the contents of GNP and h-BN were 15.0 and 20.0 phr, respectively.

Original languageEnglish
Pages (from-to)4635-4643
Number of pages9
JournalJournal of Composite Materials
Volume54
Issue number29
DOIs
StatePublished - 2020.12.1

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 9 - Industry, Innovation, and Infrastructure
    SDG 9 Industry, Innovation, and Infrastructure

Keywords

  • 3D printing
  • Additive manufacturing
  • composite
  • epoxy
  • heat dissipation material
  • IR

Quacquarelli Symonds(QS) Subject Topics

  • Engineering - Mechanical
  • Materials Science

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