Skip to main navigation Skip to search Skip to main content

Hybridization of hexagonal boron nitride nanosheets and multilayer graphene: Enhanced thermal properties of epoxy composites

  • M. Wasim Akhtar*
  • , Jong Seok Kim
  • , Muddassir Ali Memon
  • , Muhammad Moazam Baloch
  • *Corresponding author for this work
  • Mehran University of Engineering & Technology
  • Jeonbuk National University

Research output: Contribution to journalJournal articlepeer-review

Abstract

We report an effective and reproducible method for hybridization of surface modified hexagonal boron nitride (h-BNNS) and multilayer graphene (MLG) by silane coupling agents. Simultaneously, silver (Ag) nanoparticles were grown on the interface of hybrid filler as a bridging agent during the hybridization process that activates free transportation of phonons when incorporated with epoxy matrix. Hybridization of surface modified h-BNNS and MLG improved the interfacial properties and the dispersion of the filler in the epoxy matrix. The hybrid filler BNNS-Ag-MLG (H-BSG) incorporated in the epoxy matrix and characterized for thermal properties. The thermal analysis confirmed that exceptionally improved thermal conductive and excellent thermally stable epoxy composite was fabricated. It was found that ~26 folds improvement in in-plane thermal conductivity was recorded by addition of 10 wt % of H-BSG in comparison with neat epoxy. This study indicates a step towards developing a strong interfacial connection between MLG and h-BNNS to make effective hybrid filler and emerging candidate for thermal interface applications.

Original languageEnglish
Article number108183
JournalComposites Science and Technology
Volume195
DOIs
StatePublished - 2020.07.28

Keywords

  • Epoxy composite
  • Hybrid filler
  • Hybridization
  • Interface
  • Thermal conductivity

Quacquarelli Symonds(QS) Subject Topics

  • Materials Science

Fingerprint

Dive into the research topics of 'Hybridization of hexagonal boron nitride nanosheets and multilayer graphene: Enhanced thermal properties of epoxy composites'. Together they form a unique fingerprint.

Cite this