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Improvement of light extraction efficiency of flip-chip light-emitting diode by texturing the bottom side surface of sapphire substrate

  • Dae Seob Han*
  • , Ja Yeon Kim
  • , Seok In Na
  • , Sang Hoon Kim
  • , Ki Dong Lee
  • , Bongjin Kim
  • , Seong Ju Park
  • *Corresponding author for this work
  • Gwangju Institute of Science and Technology
  • LG Corporation
  • Ninex, Co., Ltd.

Research output: Contribution to journalJournal articlepeer-review

Abstract

A high light-extraction efficiency was demonstrated in the flip-chip light-emitting diode (FCLED) with a textured sapphire substrate. The bottom side of a sapphire substrate was patterned using a dry etching process to increase the light-extraction efficiency. Light output power measurements indicated that the scattering of photons emitted in the active layer was considerably enhanced at the texturcd sapphire substrate resulting in an increase in the probability of escaping from the FCLED. The light-output power of the FCLED was increased by 40.2% for a 0.4-μm deep FCLED with a periodic distance of 13-μm mesh-type texture on the bottom side of the sapphire substrate.

Original languageEnglish
Pages (from-to)1406-1408
Number of pages3
JournalIEEE Photonics Technology Letters
Volume18
Issue number13
DOIs
StatePublished - 2006

Keywords

  • Dry etching
  • Extraction efficiency
  • GaN
  • Inductively coupled plasma (TCP)
  • Light-emitting diodes (LEDs)
  • Light-output power
  • Sapphire etching

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