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Intense Pulsed Light Annealing for High-k Capacitor Integration in 1T-1C DRAM with a-IGZO Cell Transistors

  • Heetae Kim
  • , Seohak Park
  • , Johak Jeong
  • , Jihoon Jeon
  • , Hoseok Lee
  • , Chihun Sung
  • , Jeho Na
  • , Min Ju Kim
  • , Seong Keun Kim
  • , Sung Yool Choi
  • , Keun Heo
  • , Sung Haeng Cho
  • , Byung Jin Cho*
  • *Corresponding author for this work
  • Korea Advanced Institute of Science and Technology
  • Jeonbuk National University
  • Korea University
  • Korea Institute of Science and Technology
  • Electronics and Telecommunications Research Institute
  • Dankook University

Research output: Contribution to journalJournal articlepeer-review

Abstract

In this study, we report the integration of an a-IGZO cell transistor and a high-k ZrO2 cell capacitor using Intense Pulsed Light (IPL) annealing for 1T-1C DRAM application. With IPL annealing, the ZrO2 capacitor can successfully achieve a high k-value of 33, without any detrimental effect to the electrical performance of the IGZO transistor which is vulnerable to high temperature process. The a-IGZO transistor could maintain an ultra-low leakage current of 1.3 × 10-16 A/μ m, even after the high-k dielectric crystallization process.

Original languageEnglish
Pages (from-to)2431-2434
Number of pages4
JournalIEEE Electron Device Letters
Volume45
Issue number12
DOIs
StatePublished - 2024

Keywords

  • 1T-1C DRAM
  • high-k dielectric
  • Intense pulsed light
  • oxide semiconductor

Quacquarelli Symonds(QS) Subject Topics

  • Materials Science
  • Engineering - Electrical & Electronic
  • Engineering - Petroleum

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