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Investigation of Self-Heating Effects in Gate-All-Around MOSFETs with Vertically Stacked Multiple Silicon Nanowire Channels

  • Jun Young Park
  • , Byung Hyun Lee
  • , Ki Soo Chang
  • , Dong Uk Kim
  • , Chanbae Jeong
  • , Choong Ki Kim
  • , Hagyoul Bae
  • , Yang Kyu Choi*
  • *Corresponding author for this work
  • Korea Advanced Institute of Science and Technology
  • Samsung
  • Korea Basic Science Institute

Research output: Contribution to journalJournal articlepeer-review

Abstract

The self-heating effects (SHEs) in gate-all-around (GAA) MOSFETs with vertically stacked silicon nanowire (SiNW) channels are investigated. Direct observations using thermal images, electrical proof measurements, and supportive numerical simulations are carried out to verify the SHEs. This paper examines the location of hot spots as well as heat dissipation paths (heat sink) depending on the device geometry, and the electrical degradation produced by the SHEs. It also includes the estimation of the surface temperature of the GAA MOSFET and the average temperature across the bulk channel. Design parameters for improved management of the heat dissipation in a device are suggested. This investigation can contribute to improve the device performance and reliability of a 3-D stacked structure.

Original languageEnglish
Article number8031976
Pages (from-to)4393-4399
Number of pages7
JournalIEEE Transactions on Electron Devices
Volume64
Issue number11
DOIs
StatePublished - 2017.11

Keywords

  • Degradation
  • electrothermal effects
  • gate-all-around (GAA)
  • MOSFET
  • reliability
  • self-heating effects (SHEs)
  • silicon nanowire (SiNW)
  • vertically stacked silicon channels

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