Large scale thin film thickness uniformity extraction based on dynamic spectroscopic ellipsometry

Daesuk Kim; Gukhyeon Hwang; Gukhyeon Hwang; Sukhyun Choi; Vamara Dembele; Saeid Kheiryzadehkhanghah; Inho Choi; Chung Song Kim; Daesuk Kim

doi:10.1117/12.2616271

Large scale thin film thickness uniformity extraction based on dynamic spectroscopic ellipsometry

Daesuk Kim^*
, Gukhyeon Hwang
, Gukhyeon Hwang
, Sukhyun Choi
, Vamara Dembele
, Saeid Kheiryzadehkhanghah
, Inho Choi
, Chung Song Kim
, Daesuk Kim^*

^*Corresponding author for this work

Division of Mechanical System Engineering

Jeonbuk National University

Research output: Contribution to conference › Conference paper › peer-review

1 Scopus citations

Abstract

This paper describes a new approach for large-scale thin film thickness mapping based on dynamic spectroscopic ellipsometry. The proposed system can provide a real time thin film uniformity measurement capability with high precision. We expect the proposed scheme can be applied for various large-scale thin film deposition process applications such as roll to roll manufacturing where real time process uniformity monitoring becomes crucial.

Original language	English
Title of host publication	Optical Technology and Measurement for Industrial Applications Conference 2021
Editors	Takeshi Hatsuzawa, Rainer Tutsch, Toru Yoshizawa
Publisher	SPIE
ISBN (Electronic)	9781510647220
DOIs	https://doi.org/10.1117/12.2616271
State	Published - 2021
Event	Optical Technology and Measurement for Industrial Applications Conference 2021 - Virtual, Online, Japan Duration: 2021.04.20 → 2021.04.22

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	11927
ISSN (Print)	0277-786X
ISSN (Electronic)	1996-756X

Conference

Conference	Optical Technology and Measurement for Industrial Applications Conference 2021
Country/Territory	Japan
City	Virtual, Online
Period	21.04.20 → 21.04.22

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

Imaging spectroscopic ellipsometry
Large-scale
Snapshot
Thin film thickness

Quacquarelli Symonds(QS) Subject Topics

Materials Science
Computer Science & Information Systems
Mathematics
Engineering - Electrical & Electronic
Engineering - Petroleum
Data Science
Physics & Astronomy

Access to Document

10.1117/12.2616271

Cite this

Kim, D., Hwang, G., Hwang, G., Choi, S., Dembele, V., Kheiryzadehkhanghah, S., Choi, I., Kim, C. S., & Kim, D. (2021). Large scale thin film thickness uniformity extraction based on dynamic spectroscopic ellipsometry. In T. Hatsuzawa, R. Tutsch, & T. Yoshizawa (Eds.), Optical Technology and Measurement for Industrial Applications Conference 2021 Article 119270M (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 11927). SPIE. https://doi.org/10.1117/12.2616271

Kim, Daesuk ; Hwang, Gukhyeon ; Hwang, Gukhyeon et al. / Large scale thin film thickness uniformity extraction based on dynamic spectroscopic ellipsometry. Optical Technology and Measurement for Industrial Applications Conference 2021. editor / Takeshi Hatsuzawa ; Rainer Tutsch ; Toru Yoshizawa. SPIE, 2021. (Proceedings of SPIE - The International Society for Optical Engineering).

@inproceedings{4f74befba24e4a8db6b41dad39680598,

title = "Large scale thin film thickness uniformity extraction based on dynamic spectroscopic ellipsometry",

abstract = "This paper describes a new approach for large-scale thin film thickness mapping based on dynamic spectroscopic ellipsometry. The proposed system can provide a real time thin film uniformity measurement capability with high precision. We expect the proposed scheme can be applied for various large-scale thin film deposition process applications such as roll to roll manufacturing where real time process uniformity monitoring becomes crucial.",

keywords = "Imaging spectroscopic ellipsometry, Large-scale, Snapshot, Thin film thickness",

author = "Daesuk Kim and Gukhyeon Hwang and Gukhyeon Hwang and Sukhyun Choi and Vamara Dembele and Saeid Kheiryzadehkhanghah and Inho Choi and Kim, \{Chung Song\} and Daesuk Kim",

note = "Publisher Copyright: {\textcopyright} 2021 SPIE.; Optical Technology and Measurement for Industrial Applications Conference 2021 ; Conference date: 20-04-2021 Through 22-04-2021",

year = "2021",

doi = "10.1117/12.2616271",

language = "English",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

publisher = "SPIE",

editor = "Takeshi Hatsuzawa and Rainer Tutsch and Toru Yoshizawa",

booktitle = "Optical Technology and Measurement for Industrial Applications Conference 2021",

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Kim, D, Hwang, G, Hwang, G, Choi, S, Dembele, V, Kheiryzadehkhanghah, S, Choi, I, Kim, CS & Kim, D 2021, Large scale thin film thickness uniformity extraction based on dynamic spectroscopic ellipsometry. in T Hatsuzawa, R Tutsch & T Yoshizawa (eds), Optical Technology and Measurement for Industrial Applications Conference 2021., 119270M, Proceedings of SPIE - The International Society for Optical Engineering, vol. 11927, SPIE, Optical Technology and Measurement for Industrial Applications Conference 2021, Virtual, Online, Japan, 21.04.20. https://doi.org/10.1117/12.2616271

Large scale thin film thickness uniformity extraction based on dynamic spectroscopic ellipsometry. / Kim, Daesuk; Hwang, Gukhyeon; Hwang, Gukhyeon et al.
Optical Technology and Measurement for Industrial Applications Conference 2021. ed. / Takeshi Hatsuzawa; Rainer Tutsch; Toru Yoshizawa. SPIE, 2021. 119270M (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 11927).

Research output: Contribution to conference › Conference paper › peer-review

TY - GEN

T1 - Large scale thin film thickness uniformity extraction based on dynamic spectroscopic ellipsometry

AU - Kim, Daesuk

AU - Hwang, Gukhyeon

AU - Choi, Sukhyun

AU - Dembele, Vamara

AU - Kheiryzadehkhanghah, Saeid

AU - Choi, Inho

AU - Kim, Chung Song

AU - Kim, Daesuk

PY - 2021

Y1 - 2021

N2 - This paper describes a new approach for large-scale thin film thickness mapping based on dynamic spectroscopic ellipsometry. The proposed system can provide a real time thin film uniformity measurement capability with high precision. We expect the proposed scheme can be applied for various large-scale thin film deposition process applications such as roll to roll manufacturing where real time process uniformity monitoring becomes crucial.

AB - This paper describes a new approach for large-scale thin film thickness mapping based on dynamic spectroscopic ellipsometry. The proposed system can provide a real time thin film uniformity measurement capability with high precision. We expect the proposed scheme can be applied for various large-scale thin film deposition process applications such as roll to roll manufacturing where real time process uniformity monitoring becomes crucial.

KW - Imaging spectroscopic ellipsometry

KW - Large-scale

KW - Snapshot

KW - Thin film thickness

UR - https://www.scopus.com/pages/publications/85120492516

U2 - 10.1117/12.2616271

DO - 10.1117/12.2616271

M3 - Conference paper

AN - SCOPUS:85120492516

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Optical Technology and Measurement for Industrial Applications Conference 2021

A2 - Hatsuzawa, Takeshi

A2 - Tutsch, Rainer

A2 - Yoshizawa, Toru

PB - SPIE

T2 - Optical Technology and Measurement for Industrial Applications Conference 2021

Y2 - 20 April 2021 through 22 April 2021

ER -

Kim D, Hwang G, Hwang G, Choi S, Dembele V, Kheiryzadehkhanghah S et al. Large scale thin film thickness uniformity extraction based on dynamic spectroscopic ellipsometry. In Hatsuzawa T, Tutsch R, Yoshizawa T, editors, Optical Technology and Measurement for Industrial Applications Conference 2021. SPIE. 2021. 119270M. (Proceedings of SPIE - The International Society for Optical Engineering). doi: 10.1117/12.2616271

Large scale thin film thickness uniformity extraction based on dynamic spectroscopic ellipsometry

Abstract

Publication series

Conference

UN SDGs

Keywords

Quacquarelli Symonds(QS) Subject Topics

Access to Document

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