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Long-Range Uniform Deposition of Ag Nanoseed on Cu Current Collector for High-Performance Lithium Metal Batteries

  • Ju Ye Kim
  • , Oh B. Chae
  • , Gukbo Kim
  • , Andrew A. Peterson
  • , Mihye Wu*
  • , Hee Tae Jung*
  • *Corresponding author for this work
  • Korea Advanced Institute of Science and Technology
  • Brown University
  • Gachon University
  • Korea Research Institute of Chemical Technology

Research output: Contribution to journalJournal articlepeer-review

Abstract

Uniform lithium deposition is essential to hinder dendritic growth. Achieving this demands even seed material distribution across the electrode, posing challenges in correlating the electrode's surface structure with the uniformity of seed material distribution. In this study, the effect of periodic surface and facet orientation on seed distribution is investigated using a model system consisting of a wrinkled copper (Cu)/graphene structure with a [100] facet orientation. A new methodology is developed for uniformly distributed silver (Ag) nanoparticles over a large area by controlling the surface features of Cu substrates. The regularly arranged Ag nanoparticles, with a diameter of 26.4 nm, are fabricated by controlling the Cu surface condition as [100]-oriented wrinkled Cu. The wrinkled Cu guides a deposition site for spherical Ag nanoparticles, the [100] facet determines the Ag morphology, and the presence of graphene leads to spacings of Ag seeds. This patterned surface and high lithiophilicity, with homogeneously distributed Ag nanoparticles, lead to uniform Li+ flux and reduced nucleation energy barrier, resulting in excellent battery performance. The electrochemical measurements exhibit improved cyclic stability over 260 cycles at 0.5 mA cm−2 and 100 cycles at 1.0 mA cm−2 and enhanced kinetics even under a high current density of 5.0 mA cm−2.

Original languageEnglish
Article number2307200
JournalSmall
Volume20
Issue number24
DOIs
StatePublished - 2024.06.12

Keywords

  • dendrite-free anode
  • lithium metal battery
  • uniform Cu facet
  • uniform seed distribution
  • wrinkled Cu substrate

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