Measurement and evaluation of thermal expansion coefficients of micrometer-sized SiO₂ particle-reinforced epoxy composites

In this experimental study, the thermal stability values of micrometer-sized silica particle-reinforced epoxy composite specimens were evaluated by measuring their thermal expansion coefficients and Young's moduli. For all specimens used in this study (from the baseline specimen to that containing 70 wt% silica filler), the thermal expansion coefficients and Young's moduli were gradually reduced down to 25% and increased up to 51%, respectively. The results of the experiment were compared with those of certain empirical models. The experimental results of the measurement of thermal expansion coefficients corresponded well with those of Kerner's model, which considers the bulk and shear moduli of the matrix and silica filler. However, the results of the measurement of Young's moduli using the empirical Mori-Tanaka model were observed to match better with those of the experiment. The comparison of the results of the experiment with those of the empirical models demonstrated that a reliable model for measuring the thermal expansion coefficients and Young's moduli of composite specimens needs to consider certain property variations in the composites in addition to volume fraction changes in the filler and matrix.