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Modeling and separate extraction of gate-bias- and channel-length-dependent intrinsic and extrinsic sourcedrain resistances in MOSFETs

  • Hagyoul Bae*
  • , Jaeman Jang
  • , Ja Sun Shin
  • , Daeyoun Yun
  • , Jieun Lee
  • , Tae Wan Kim
  • , Dae Hwan Kim
  • , Dong Myong Kim
  • *Corresponding author for this work
  • Kookmin University
  • Hongik University

Research output: Contribution to journalJournal articlepeer-review

Abstract

A new technique for a separate extraction of the current-path-dependent resistance (RSD0) from the contact-dependent source and drain resistances (RSe and RDe) is reported for a single MOSFET. We also report a technique for a separation of VGS -dependent source and drain resistance (RSDi) from the VGS- and L eff-dependent channel resistance (Rch) with multiple MOSFETs. We confirm the proposed techniques applied to n-channel MOSFETs with various W/L combinations and obtain RSe = 10.5 - 12.4 Ω, R De ≅ 12.7 Ω, and RSD0 = 4.7 Ω for W = 10 μm. VGS-dependent but L-independent RSDi is extracted to be 2.8 - 4.2 Ω.

Original languageEnglish
Article number5756637
Pages (from-to)722-724
Number of pages3
JournalIEEE Electron Device Letters
Volume32
Issue number6
DOIs
StatePublished - 2011.06

Keywords

  • Drain resistance
  • extraction
  • extrinsic
  • intrinsic resistance
  • MOSFET
  • parasitic resistance
  • source resistance

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