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Molecularly engineered copolyimide film for capacitive humidity sensor

  • Il Jin Kim
  • , Ji Eun Lee
  • , Jae Wang Ko
  • , Jiyoon Jung
  • , Albert S. Lee
  • , Dong Jin Lee
  • , Seung Geol Lee
  • , Bo In Park
  • , Seunggun Yu*
  • , Jin Hong Lee
  • *Corresponding author for this work
  • Korea Institute of Footwear and Leather Technology (KIFLT)
  • Pusan National University
  • Korea Institute of Science and Technology
  • Korea Advanced Institute of Science and Technology
  • Korea Electrotechnology Research Institute

Research output: Contribution to journalJournal articlepeer-review

Abstract

We present a capacitive humidity sensor with molecularly engineered polyimide (PI) sensing layer. Molecularly engineered PIs were successfully prepared by synthesizing polyamic acids (PAAs) through blending of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) with 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA), pyromellitic dianhydride (PMDA), and 4,4-(hexafluoroisopropylidene) diphthalic anhydride (6-FDA) as monomer, followed by thermal imidization, respectively. The molecularly engineered PIs exhibited high thermal stability as well as controllable water uptake properties. Capacitive performances of the humidity sensor with PIs were efficiently increased via simple molecular blending.

Original languageEnglish
Article number127565
JournalMaterials Letters
Volume268
DOIs
StatePublished - 2020.06.1

Keywords

  • Capacitance
  • Humidity sensor
  • Hysteresis
  • Polyimide

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