Monolithic electronic nose system fabricated by post CMOS micromachining

Seong M. Cho; Sang Choon Ko; Seung Chul Ha; Yong Shin Kim; Young Jun Kim; Yoonseok Yang; Hyeon Bong Pyo; Chang Auck Choi

doi:10.1109/ICSENS.2005.1597725

Monolithic electronic nose system fabricated by post CMOS micromachining

Seong M. Cho^*
, Sang Choon Ko
, Seung Chul Ha
, Yong Shin Kim
, Young Jun Kim
, Yoonseok Yang
, Hyeon Bong Pyo
, Chang Auck Choi

^*Corresponding author for this work

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Electronics and Telecommunications Research Institute

Research output: Contribution to conference › Conference paper › peer-review

2 Scopus citations

Abstract

A monolithic electronic nose system, which has 12 independent channels, was fabricated by post CMOS micromachining process. Read-out integrated circuits were fabricated with the standard CMOS processes with design rule of 0.8 μm. And, the MEMS parts of the electronic nose were fabricated by hybrid etching, composed of bulk micromachining with TMAH (Tetramethy lammonium hydroxide) and deep dry etching, on the backside of the wafer after the CMOS processes. Resistance matching circuit, Instrumentation amplifier, multiplexer, and transducer circuits with bridge structure were included in the read-out circuitry. And, heat control circuits were also implanted in the monolithic circuit to maintain the temperature of the MEMS sensing parts as constant. Carbon black-polymer composites and Au nano-particles were used as sensor materials. The MEMS parts of the electronic nose were designed to have well-shaped structures. These structures are considered to be suitable for drop coating procedure.

Original language	English
Title of host publication	Proceedings of the Fourth IEEE Conference on Sensors 2005
Pages	420-423
Number of pages	4
DOIs	https://doi.org/10.1109/ICSENS.2005.1597725
State	Published - 2005
Event	Fourth IEEE Conference on Sensors 2005 - Irvine, CA, United States Duration: 2005.10.31 → 2005.11.3

Publication series

Name	Proceedings of IEEE Sensors
Volume	2005

Conference

Conference	Fourth IEEE Conference on Sensors 2005
Country/Territory	United States
City	Irvine, CA
Period	05.10.31 → 05.11.3

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

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10.1109/ICSENS.2005.1597725

Cite this

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title = "Monolithic electronic nose system fabricated by post CMOS micromachining",

abstract = "A monolithic electronic nose system, which has 12 independent channels, was fabricated by post CMOS micromachining process. Read-out integrated circuits were fabricated with the standard CMOS processes with design rule of 0.8 μm. And, the MEMS parts of the electronic nose were fabricated by hybrid etching, composed of bulk micromachining with TMAH (Tetramethy lammonium hydroxide) and deep dry etching, on the backside of the wafer after the CMOS processes. Resistance matching circuit, Instrumentation amplifier, multiplexer, and transducer circuits with bridge structure were included in the read-out circuitry. And, heat control circuits were also implanted in the monolithic circuit to maintain the temperature of the MEMS sensing parts as constant. Carbon black-polymer composites and Au nano-particles were used as sensor materials. The MEMS parts of the electronic nose were designed to have well-shaped structures. These structures are considered to be suitable for drop coating procedure.",

author = "Cho, \{Seong M.\} and Ko, \{Sang Choon\} and Ha, \{Seung Chul\} and Kim, \{Yong Shin\} and Kim, \{Young Jun\} and Yoonseok Yang and Pyo, \{Hyeon Bong\} and Choi, \{Chang Auck\}",

year = "2005",

doi = "10.1109/ICSENS.2005.1597725",

language = "English",

isbn = "0780390563",

series = "Proceedings of IEEE Sensors",

pages = "420--423",

booktitle = "Proceedings of the Fourth IEEE Conference on Sensors 2005",

note = "Fourth IEEE Conference on Sensors 2005 ; Conference date: 31-10-2005 Through 03-11-2005",

}

Cho, SM, Ko, SC, Ha, SC, Kim, YS, Kim, YJ, Yang, Y, Pyo, HB & Choi, CA 2005, Monolithic electronic nose system fabricated by post CMOS micromachining. in Proceedings of the Fourth IEEE Conference on Sensors 2005., 1597725, Proceedings of IEEE Sensors, vol. 2005, pp. 420-423, Fourth IEEE Conference on Sensors 2005, Irvine, CA, United States, 05.10.31. https://doi.org/10.1109/ICSENS.2005.1597725

TY - GEN

T1 - Monolithic electronic nose system fabricated by post CMOS micromachining

AU - Cho, Seong M.

AU - Ko, Sang Choon

AU - Ha, Seung Chul

AU - Kim, Yong Shin

AU - Kim, Young Jun

AU - Yang, Yoonseok

AU - Pyo, Hyeon Bong

AU - Choi, Chang Auck

PY - 2005

Y1 - 2005

N2 - A monolithic electronic nose system, which has 12 independent channels, was fabricated by post CMOS micromachining process. Read-out integrated circuits were fabricated with the standard CMOS processes with design rule of 0.8 μm. And, the MEMS parts of the electronic nose were fabricated by hybrid etching, composed of bulk micromachining with TMAH (Tetramethy lammonium hydroxide) and deep dry etching, on the backside of the wafer after the CMOS processes. Resistance matching circuit, Instrumentation amplifier, multiplexer, and transducer circuits with bridge structure were included in the read-out circuitry. And, heat control circuits were also implanted in the monolithic circuit to maintain the temperature of the MEMS sensing parts as constant. Carbon black-polymer composites and Au nano-particles were used as sensor materials. The MEMS parts of the electronic nose were designed to have well-shaped structures. These structures are considered to be suitable for drop coating procedure.

AB - A monolithic electronic nose system, which has 12 independent channels, was fabricated by post CMOS micromachining process. Read-out integrated circuits were fabricated with the standard CMOS processes with design rule of 0.8 μm. And, the MEMS parts of the electronic nose were fabricated by hybrid etching, composed of bulk micromachining with TMAH (Tetramethy lammonium hydroxide) and deep dry etching, on the backside of the wafer after the CMOS processes. Resistance matching circuit, Instrumentation amplifier, multiplexer, and transducer circuits with bridge structure were included in the read-out circuitry. And, heat control circuits were also implanted in the monolithic circuit to maintain the temperature of the MEMS sensing parts as constant. Carbon black-polymer composites and Au nano-particles were used as sensor materials. The MEMS parts of the electronic nose were designed to have well-shaped structures. These structures are considered to be suitable for drop coating procedure.

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U2 - 10.1109/ICSENS.2005.1597725

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M3 - Conference paper

AN - SCOPUS:33847275678

SN - 0780390563

SN - 9780780390560

T3 - Proceedings of IEEE Sensors

SP - 420

EP - 423

BT - Proceedings of the Fourth IEEE Conference on Sensors 2005

T2 - Fourth IEEE Conference on Sensors 2005

Y2 - 31 October 2005 through 3 November 2005

ER -

Monolithic electronic nose system fabricated by post CMOS micromachining

Abstract

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UN SDGs

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