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Nanoscale resistive switching of a copper-carbon-mixed layer for nonvolatile memory applications

  • Hyejung Choi*
  • , Myeongbum Pyun
  • , Tae Wook Kim
  • , Musarrat Hasan
  • , Rui Dong
  • , Joonmyoung Lee
  • , Ju Bong Park
  • , Jaesik Yoon
  • , Dong Jun Seong
  • , Takhee Lee
  • , Hyunsang Hwang
  • *Corresponding author for this work
  • Gwangju Institute of Science and Technology

Research output: Contribution to journalJournal articlepeer-review

Abstract

The nanoscale resistance switching property of copper-carbon-mixed (Cu-C) layer was investigated for nonvolatile memory applications. The Cu-C layer of the cross-point cell array showed typical filament switching with two orders of on/off ratio, exhibiting stable resistance switching and a narrow distribution of set and reset voltages in the nanoscale junction. In addition, we investigated the area dependence of operation current. Based on these results and current-voltage dependence on temperature, we discussed a potential switching mechanism of Cu-C layer.

Original languageEnglish
Pages (from-to)302-304
Number of pages3
JournalIEEE Electron Device Letters
Volume30
Issue number3
DOIs
StatePublished - 2009

Keywords

  • Cell array
  • Copper-carbon-mixed (Cu-C) layer
  • Resistance random access memory
  • Resistive switching

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