@inproceedings{51a6d4523c934cd995db8a8e55456289,
title = "Novel applications of intense pulsed ion beams in materials science",
abstract = "Using pulsed ion beam evaporation technique, experimental studies were carried out to embed metals into via holes in LSI. It will be shown that tungsten is successfully embedded in via holes with the aspect ratio of 4.3. Furthermore, light emission of blue has been observed from a poly silicon nanosize powders, which is also produced by pulsed ion beam evaporation technique.",
author = "K. Yatsui and W. Jiang and H. Suematsu and F. Endo and Yang, \{S. C.\}",
year = "2002",
doi = "10.1063/1.1530882",
language = "English",
isbn = "9780735401075",
series = "BEAMS 2002 - 14th International Conference on High-Power Particle Beams",
publisher = "IEEE Computer Society",
pages = "401--404",
booktitle = "BEAMS 2002 - 14th International Conference on High-Power Particle Beams",
note = "14th International Conference on High-Power Particle Beams, BEAMS 2002 and the 5th International Conference on Dense Z-Pinches, DZP 2002 ; Conference date: 23-06-2002 Through 28-06-2002",
}