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N2-annealing effects on characteristics of Schottky-barrier MOSFETS

  • Moongyu Jang*
  • , Yarkyeon Kim
  • , Myungsim Jeon
  • , Cheljong Choi
  • , Inbok Baek
  • , Seongjae Lee
  • , Byoungchul Park
  • *Corresponding author for this work
  • Electronics and Telecommunications Research Institute
  • Chungnam National University

Research output: Contribution to journalJournal articlepeer-review

Abstract

Schottky-barrier (SB) heights of erbium and platinum silicides are evaluated using current-voltage and capacitance-voltage methods in the Schottky diodes. For the erbium-silicided Schottky diodes, the extracted SB heights show big differences depending on the extraction methods, due to the existence of the interface traps. The interface traps in the erbium silicide are efficiently cured by N2 annealing. Various sizes of the erbium/platinum-silicided n/p-type SB-MOSFETs are manufactured from 20 μm to 23 nm. Also, N2 annealing is applied to enhance the SB-MOSFETs' subthreshold characteristics by minimizing the interface-trap density. The manufactured SB-MOSFETs show a good drain-induced barrier thinning and subthreshold swing characteristics, due to the existence of a SB between the source and the channel, which indicates the possible application of the SB-MOSFETs in a nanoscale regime.

Original languageEnglish
Pages (from-to)1821-1825
Number of pages5
JournalIEEE Transactions on Electron Devices
Volume53
Issue number8
DOIs
StatePublished - 2006.08

Keywords

  • Drain-induced barrier thinning (DIBT)
  • Interface trap
  • SB-MOSFETs
  • Scaling
  • Schottky diode
  • Subthreshold swing (SS)

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