Abstract
SrBi 2Ta 2O 9 (SBT) thin films were etched in a planar type inductively coupled plasma (ICP) etcher with different chemistries of Cl 2/Ar, Cl 2/NF 3/Ar, and Cl 2/NF 3/O 2/Ar. The etch rate was a strong function of gas concentration, ICP source power, and rf chuck power. Cl 2/NF 3/Ar and Cl 2/NF 3/O 2/Ar plasmas showed maximum etch rates of ∼1600 Å/min at 5 mTorr, 700 W ICP power, and 150 W rf chuck power. Electrical properties of the SBT films were dependent on the plasma chemistry employed; Cl 2/NF 3/O 2/Ar showed the least damage in the films and resulted in the best overall P-E hysteresis loops compared to other chemistries.
| Original language | English |
|---|---|
| Pages (from-to) | G17-G19 |
| Journal | Electrochemical and Solid-State Letters |
| Volume | 4 |
| Issue number | 2 |
| DOIs | |
| State | Published - 2001.02 |
Quacquarelli Symonds(QS) Subject Topics
- Materials Science
- Engineering - Electrical & Electronic
- Engineering - Petroleum
- Engineering - Chemical
- Chemistry
Fingerprint
Dive into the research topics of 'Plasma chemistries for dry etching of SrBi 2Ta 2O 9 thin films'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver