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Plasma chemistries for dry etching of SrBi 2Ta 2O 9 thin films

  • J. S. Park
  • , Y. H. Im
  • , R. J. Choi
  • , Y. B. Hahn*
  • , C. S. Choi
  • , S. H. Lee
  • , J. K. Lee
  • *Corresponding author for this work
  • A School of Chemical Engineering and Technology
  • Jeonbuk National University
  • Korea Institute of Science and Technology

Research output: Contribution to journalJournal articlepeer-review

Abstract

SrBi 2Ta 2O 9 (SBT) thin films were etched in a planar type inductively coupled plasma (ICP) etcher with different chemistries of Cl 2/Ar, Cl 2/NF 3/Ar, and Cl 2/NF 3/O 2/Ar. The etch rate was a strong function of gas concentration, ICP source power, and rf chuck power. Cl 2/NF 3/Ar and Cl 2/NF 3/O 2/Ar plasmas showed maximum etch rates of ∼1600 Å/min at 5 mTorr, 700 W ICP power, and 150 W rf chuck power. Electrical properties of the SBT films were dependent on the plasma chemistry employed; Cl 2/NF 3/O 2/Ar showed the least damage in the films and resulted in the best overall P-E hysteresis loops compared to other chemistries.

Original languageEnglish
Pages (from-to)G17-G19
JournalElectrochemical and Solid-State Letters
Volume4
Issue number2
DOIs
StatePublished - 2001.02

Quacquarelli Symonds(QS) Subject Topics

  • Materials Science
  • Engineering - Electrical & Electronic
  • Engineering - Petroleum
  • Engineering - Chemical
  • Chemistry

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