Plasma cleaning of various electronic packaging materials to improve adhesion property

K. H. Paek; W. T. Ju; Y. H. Kim; J. H. Seo; D. Y. Kim; Y. S. Hwang; W. H. Choe; J. J. Choi

Plasma cleaning of various electronic packaging materials to improve adhesion property

K. H. Paek^*
, W. T. Ju
, Y. H. Kim
, J. H. Seo
, D. Y. Kim
, Y. S. Hwang
, W. H. Choe
, J. J. Choi

^*Corresponding author for this work

Department of Quantum System Engineering

Seoul National University

Research output: Contribution to journal › Conference article › peer-review

Abstract

Advanced integrated circuit packaging processes require high bondability and reliability between various mating surfaces and a key factor affecting this requirements is the surface cleanliness. Contaminants degrading adhesion property include organic or oxide layer and these impurities should be thoroughly removed before bonding process. Plasma can be used for this purpose and has many potential advantages - reduction of processing waste, cleaner surface, controllability and dry process, in comparison to chemical cleaning. Nonthermal plasma generated at atmospheric pressure has been used in cleaning a surface of wire bonding substrates and flip chip bumps widely used in today!/s packaging industry. Relation between the processing parameters (processing time, gas composition, additional UV exposure) and bonding characteristics has been investigated.

Original language	English
Pages (from-to)	P4J07
Journal	IEEE International Conference on Plasma Science
State	Published - 2001
Event	28th IEEE International Conference on Plasma Science/ 13th IEEE International Pulsed Power Conference - Las Vegas, NV, United States Duration: 2001.06.17 → 2001.06.22

Cite this

@article{de5db732276847fdbb85e1e705175fed,

title = "Plasma cleaning of various electronic packaging materials to improve adhesion property",

abstract = "Advanced integrated circuit packaging processes require high bondability and reliability between various mating surfaces and a key factor affecting this requirements is the surface cleanliness. Contaminants degrading adhesion property include organic or oxide layer and these impurities should be thoroughly removed before bonding process. Plasma can be used for this purpose and has many potential advantages - reduction of processing waste, cleaner surface, controllability and dry process, in comparison to chemical cleaning. Nonthermal plasma generated at atmospheric pressure has been used in cleaning a surface of wire bonding substrates and flip chip bumps widely used in today!/s packaging industry. Relation between the processing parameters (processing time, gas composition, additional UV exposure) and bonding characteristics has been investigated.",

author = "Paek, \{K. H.\} and Ju, \{W. T.\} and Kim, \{Y. H.\} and Seo, \{J. H.\} and Kim, \{D. Y.\} and Hwang, \{Y. S.\} and Choe, \{W. H.\} and Choi, \{J. J.\}",

year = "2001",

language = "English",

pages = "P4J07",

journal = "IEEE International Conference on Plasma Science",

issn = "0730-9244",

note = "28th IEEE International Conference on Plasma Science/ 13th IEEE International Pulsed Power Conference ; Conference date: 17-06-2001 Through 22-06-2001",

}

TY - JOUR

T1 - Plasma cleaning of various electronic packaging materials to improve adhesion property

AU - Paek, K. H.

AU - Ju, W. T.

AU - Kim, Y. H.

AU - Seo, J. H.

AU - Kim, D. Y.

AU - Hwang, Y. S.

AU - Choe, W. H.

AU - Choi, J. J.

PY - 2001

Y1 - 2001

N2 - Advanced integrated circuit packaging processes require high bondability and reliability between various mating surfaces and a key factor affecting this requirements is the surface cleanliness. Contaminants degrading adhesion property include organic or oxide layer and these impurities should be thoroughly removed before bonding process. Plasma can be used for this purpose and has many potential advantages - reduction of processing waste, cleaner surface, controllability and dry process, in comparison to chemical cleaning. Nonthermal plasma generated at atmospheric pressure has been used in cleaning a surface of wire bonding substrates and flip chip bumps widely used in today!/s packaging industry. Relation between the processing parameters (processing time, gas composition, additional UV exposure) and bonding characteristics has been investigated.

AB - Advanced integrated circuit packaging processes require high bondability and reliability between various mating surfaces and a key factor affecting this requirements is the surface cleanliness. Contaminants degrading adhesion property include organic or oxide layer and these impurities should be thoroughly removed before bonding process. Plasma can be used for this purpose and has many potential advantages - reduction of processing waste, cleaner surface, controllability and dry process, in comparison to chemical cleaning. Nonthermal plasma generated at atmospheric pressure has been used in cleaning a surface of wire bonding substrates and flip chip bumps widely used in today!/s packaging industry. Relation between the processing parameters (processing time, gas composition, additional UV exposure) and bonding characteristics has been investigated.

UR - https://www.scopus.com/pages/publications/0035188136

M3 - Conference article

AN - SCOPUS:0035188136

SN - 0730-9244

SP - P4J07

JO - IEEE International Conference on Plasma Science

JF - IEEE International Conference on Plasma Science

T2 - 28th IEEE International Conference on Plasma Science/ 13th IEEE International Pulsed Power Conference

Y2 - 17 June 2001 through 22 June 2001

ER -

Plasma cleaning of various electronic packaging materials to improve adhesion property

Abstract

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