Property and surface morphology of copper foil on the various temperature of electrolyte

This study examined the effects of plated temperature on the surface morphology and property of an electrodeposited copper foil. The morphology, crystal structure and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity could be controlled using various temperature of electrolyte. Large particles were observed on the surface of the copper layer electroplated onto the 30°C. However, a uniform surface, lower resistivity and high flexibility were obtained when a 50°C electrolyte was used.