Recent advances in transfer printing of inorganic thin films for flexible hybrid systems

The evolution of human–machine interfaces (HMI) toward more immersive and intuitive forms, such as wearable devices and augmented reality systems, demands the development of high-performance flexible electronics. Heterogeneous integration, which combines diverse inorganic materials and functional devices onto unconventional substrates, is the core strategy for realizing these next-generation systems. The success of this approach, however, critically hinges on the ability to precisely transfer and assemble vast quantities of micro-scale components. This paper reviews the state-of-the-art in inorganic thin-film transfer technologies, which are the essential enablers for this paradigm shift. We systematically categorize and discuss the mechanisms, advantages, and drawbacks of three primary approaches: physical, chemical, and self-assembly transfer methods. Furthermore, we introduce recent applications of semiconductor devices developed via these techniques. The continued advancement of these transfer technologies is poised to catalyze transformative innovations in how users interact with the digital world, fundamentally reshaping applications in medicine, personal computing, and beyond.