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Residual stresses and thermoviscoelastic deformation of laminated film prepared for film insert molding

  • Sung Ho Kim
  • , Seong Yun Kim
  • , Seung Hwan Lee
  • , Jae Ryoun Youn*
  • *Corresponding author for this work
  • Seoul National University

Research output: Contribution to journalJournal articlepeer-review

Abstract

Residual stresses and thermoviscoelastic deformation of a laminated film utilized for film insert molding was investigated through measurement of thermal expansion coefficient (CTE) and relaxation modulus. Thermoviscoelastic deformation of the film was also analyzed with numerical analysis by applying measured relaxation modulus, CTE, and residual stress to finite element method (FEM). Stress relaxation of the pristine film showed significantly different behavior from that of the unannealed film during annealing. Effects of the CTE and relaxation modulus on the thermoviscoelastic deformation were predicted by considering thermal shrinkage and structural relaxation. Moreover, numerical results on thermoviscoelastic deformation were in good agreement with experiments when initial stress distribution in the solid specimen was applied to the numerical analysis. © 2011 Society of Plastics Engineers

Original languageEnglish
Pages (from-to)1121-1127
Number of pages7
JournalPolymer Engineering and Science
Volume52
Issue number5
DOIs
StatePublished - 2012.05

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