Robust resistive switching in solution-processed copper bromide binary metal halide system

  • Juyoung Jin
  • , Young Seok Song
  • , Ankita Nikam
  • , Hyunjung Lee
  • , Seungyeon Kim
  • , Hee Yun Yang
  • , Hyejung Choi
  • , Byung Joon Moon
  • , Sukang Bae
  • , Jongwon Yoon
  • , Seoung Ki Lee
  • , Tae Wook Kim*
  • *Corresponding author for this work

Research output: Contribution to journalJournal articlepeer-review

Abstract

Resistive switching devices utilizing metal halide materials hold great promise for flexible resistive random-access memory (RRAM) due to their low fabrication costs and low processing temperatures. However, the commercialization of these materials is hindered by issues related to phase instability and stoichiometric complexity. In this study, we demonstrate a binary metal halide-based resistive switching memory using copper bromide (CuBr) as the active component and that showed remarkable stability and reliability. The Au/CuBr/Au memristor exhibited a stable on/off ratio of 5 × 10 ¹ during low-voltage operation between 1.4 V to −1.6 V, a significant achievement for data storage devices. Detailed analysis using X-ray photoemission spectroscopy (XPS) provided insights into the chemical states and electronic structures of the CuBr layer, revealing that the resistive switching mechanism is driven by the formation of a metallic copper ion-based conductive filament (CF). This CF formation explains the area-dependent resistances and temperature-dependent resistances and is further supported by impedance spectroscopy. The devices also displayed exceptional switching stability, maintaining data integrity for more than 300 days at room temperature under ambient conditions. The device also exhibited impressive endurance, withstanding more than 1.2 × 10⁴ cycles, highlighting its potential for long-term operational stability. Additionally, the air stability of the CuBr memristors and their low-temperature solution processing make them suitable for practical memory applications. In conclusion, this research provides a robust solution to the challenges faced by halide perovskite-based memristors, offering a highly stable, ambient-condition-resistant, and low-cost memory device. The work lays the foundation for next-generation memory devices that are both durable and environmentally adaptable, contributing significantly to the advancement of memory storage technologies.

Original languageEnglish
Article number178685
JournalJournal of Alloys and Compounds
Volume1014
DOIs
StatePublished - 2025.02.5

Keywords

  • Conductive filament (CF)
  • Copper bromide
  • Metal halide
  • Resistive memory
  • Room-temperature

Quacquarelli Symonds(QS) Subject Topics

  • Materials Science
  • Engineering - Mechanical

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