Screen Printing of Highly Loaded Silver Inks on Plastic Substrates Using Silicon Stencils

Woo Jin Hyun; Sooman Lim; Bok Yeop Ahn; Jennifer A. Lewis; C. Daniel Frisbie; Lorraine F. Francis

doi:10.1021/acsami.5b02487

Screen Printing of Highly Loaded Silver Inks on Plastic Substrates Using Silicon Stencils

Woo Jin Hyun
, Sooman Lim
, Bok Yeop Ahn
, Jennifer A. Lewis
, C. Daniel Frisbie^*
, Lorraine F. Francis

^*Corresponding author for this work

Department of Flexible and Printable Electronics

University of Minnesota Twin Cities
Harvard University

Research output: Contribution to journal › Journal article › peer-review

149 Scopus citations

Abstract

Screen printing is a potential technique for mass-production of printed electronics; however, improvement in printing resolution is needed for high integration and performance. In this study, screen printing of highly loaded silver ink (77 wt %) on polyimide films is studied using fine-scale silicon stencils with openings ranging from 5 to 50 ωm wide. This approach enables printing of high-resolution silver lines with widths as small as 22 μm. The printed silver lines on polyimide exhibit good electrical properties with a resistivity of 5.5 × 10^-6 ω cm and excellent bending tolerance for bending radii greater than 5 mm (tensile strains less than 0.75%).

Original language	English
Pages (from-to)	12619-12624
Number of pages	6
Journal	ACS Applied Materials and Interfaces
Volume	7
Issue number	23
DOIs	https://doi.org/10.1021/acsami.5b02487
State	Published - 2015.06.17

Keywords

plastic substrates
printed electronics
screen printing
silicon stencils
silver ink

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10.1021/acsami.5b02487

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@article{4dc96ae455484414b42acff49dd4cae4,

title = "Screen Printing of Highly Loaded Silver Inks on Plastic Substrates Using Silicon Stencils",

abstract = "Screen printing is a potential technique for mass-production of printed electronics; however, improvement in printing resolution is needed for high integration and performance. In this study, screen printing of highly loaded silver ink (77 wt \%) on polyimide films is studied using fine-scale silicon stencils with openings ranging from 5 to 50 ωm wide. This approach enables printing of high-resolution silver lines with widths as small as 22 μm. The printed silver lines on polyimide exhibit good electrical properties with a resistivity of 5.5 × 10-6 ω cm and excellent bending tolerance for bending radii greater than 5 mm (tensile strains less than 0.75\%).",

keywords = "plastic substrates, printed electronics, screen printing, silicon stencils, silver ink",

author = "Hyun, \{Woo Jin\} and Sooman Lim and Ahn, \{Bok Yeop\} and Lewis, \{Jennifer A.\} and Frisbie, \{C. Daniel\} and Francis, \{Lorraine F.\}",

note = "Publisher Copyright: {\textcopyright} 2015 American Chemical Society.",

year = "2015",

month = jun,

day = "17",

doi = "10.1021/acsami.5b02487",

language = "English",

volume = "7",

pages = "12619--12624",

journal = "ACS Applied Materials and Interfaces",

issn = "1944-8244",

number = "23",

}

TY - JOUR

T1 - Screen Printing of Highly Loaded Silver Inks on Plastic Substrates Using Silicon Stencils

AU - Hyun, Woo Jin

AU - Lim, Sooman

AU - Ahn, Bok Yeop

AU - Lewis, Jennifer A.

AU - Frisbie, C. Daniel

AU - Francis, Lorraine F.

PY - 2015/6/17

Y1 - 2015/6/17

N2 - Screen printing is a potential technique for mass-production of printed electronics; however, improvement in printing resolution is needed for high integration and performance. In this study, screen printing of highly loaded silver ink (77 wt %) on polyimide films is studied using fine-scale silicon stencils with openings ranging from 5 to 50 ωm wide. This approach enables printing of high-resolution silver lines with widths as small as 22 μm. The printed silver lines on polyimide exhibit good electrical properties with a resistivity of 5.5 × 10-6 ω cm and excellent bending tolerance for bending radii greater than 5 mm (tensile strains less than 0.75%).

AB - Screen printing is a potential technique for mass-production of printed electronics; however, improvement in printing resolution is needed for high integration and performance. In this study, screen printing of highly loaded silver ink (77 wt %) on polyimide films is studied using fine-scale silicon stencils with openings ranging from 5 to 50 ωm wide. This approach enables printing of high-resolution silver lines with widths as small as 22 μm. The printed silver lines on polyimide exhibit good electrical properties with a resistivity of 5.5 × 10-6 ω cm and excellent bending tolerance for bending radii greater than 5 mm (tensile strains less than 0.75%).

KW - plastic substrates

KW - printed electronics

KW - screen printing

KW - silicon stencils

KW - silver ink

UR - https://www.scopus.com/pages/publications/84934928810

U2 - 10.1021/acsami.5b02487

DO - 10.1021/acsami.5b02487

M3 - Journal article

AN - SCOPUS:84934928810

SN - 1944-8244

VL - 7

SP - 12619

EP - 12624

JO - ACS Applied Materials and Interfaces

JF - ACS Applied Materials and Interfaces

IS - 23

ER -

Screen Printing of Highly Loaded Silver Inks on Plastic Substrates Using Silicon Stencils

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