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Selective chemical wet etching of Si0.8Ge0.2/Si multilayer

  • Yeon Ho Kil
  • , Jong Han Yang
  • , Sukil Kang
  • , Tae Soo Jeong
  • , Taek Sung Kim
  • , Kyu Hwan Shim
  • Jeonbuk National University

Research output: Contribution to journalJournal articlepeer-review

Abstract

We investigate the effect of the ageing time and etching time on the etching rate of SiGe mixed etching solution, namely 1 vp HF (6%), 2 vp H2O2 (30%) and 3 vp CH3COOH (99.8%). For this etching solution, we found that the etch rate of SiGe layer is saturated after the ageing time of 72 hours, and the selectivity of Si0.8Ge0.2 layer and Si layer is 20:1 at ageing time of 72 hours. The collapse was appeared at the etching time of 9min with etching solution of after saturation ageing time.

Original languageEnglish
Pages (from-to)668-675
Number of pages8
JournalJournal of Semiconductor Technology and Science
Volume13
Issue number6
DOIs
StatePublished - 2013.12

Keywords

  • Multi-layer
  • Selective etching
  • Si
  • SiGe
  • SON

Quacquarelli Symonds(QS) Subject Topics

  • Materials Science
  • Engineering - Electrical & Electronic
  • Engineering - Petroleum

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